Small modification can make emulational cell phone into a Phoenix (2)
Yue Wei (Hong Kong) Electronic Technology Company, Ltd. Shantou Chenghai office Zhang Guifeng also confirms the market forecasts of Zoubo. He says: “currently silicon MEMS gyroscope market is in short supply. We mainly use silicon MEMS gyroscope to do with attitude control of helicopter toys, during Chinese New Year, Children’s Day and Christmas, monthly the shipments are about 2 1 million or so. We concern Shen Di because its price is the lowest in the world now. “
Shen Di recently released its first commercial MEMS gyroscopes SSZ030CG; it also marks the birth of commercial MEMS gyroscopes which is the first with Chinese intellectual property rights. MEMS gyroscopes are the Components of semiconductor industry, it needs a dedicated MEMS processing technology with high-tech nature. While Europe and the United States and Japan has a number of related companies and research institutes making breakthrough in this area, but China starts late and the develop slowly in this regard, yet there is no a production company to provide processing services. Shen Di Semiconductor introduces SSZ030CG gyro which has a very high cost performance, it not only means the situation that many domestic consumer electronics manufacturers have always been dependent on imported gyroscope chip will be broken, and also marks that the innovation of China independent intellectual property rights appear the first time in the MEMS gyroscopes field.
Its appearance not only enhances the competitiveness of Chinese semiconductor industry, but also expands the consumer electronics application market, and gives the market a new concept. As the wide application of the MEMS gyroscope products in consumer electronics and automotive markets, and many other areas, it will offer great business opportunities for the majority of the Chinese relevant market, but also it will greatly enhance Chinese MEMS sensor’s international competitiveness and influence .
“As the Nintendo Wii and Apple iPhone, a new concept drives consumer electronics applications, MEMS gyroscopes applications market is growing rapidly. Silicon MEMS gyro products will be widely used in game consoles, cell phones, toys, GPS positioning, digital cameras and cameras and other consumer electronics and automotive safety and navigation, industrial, aerospace and medical equipment and other fields. “Zou Bo said,” and the design and research and development of gyroscope require high-tech threshold which makes very few competitors, it is a great opportunity for Shen Di Semiconductor to enter the market. Our competitive advantage stems from a series of independent intellectual property rights gyro inertial MEMS sensor chip design capabilities, as well as Chinese MEMS industry chain integration. We offer our customers not only advanced products, but also comprehensive solutions and quality services. I believe that customers will become partners with Shen Di and Shen Di will make a tremendous commercial success. “
He tells the reporters of “International Electronic Business” that currently Shen Di has applied 20 patents in China to protect its commercial interests. And we do not fear of overseas suppliers moving into mainland China to take our business, because they do not consider this option, because they will do not bring the core test technology into China.
In addition to consumer electronics market, Zou also reveals that currently they are moving to another large gyroscope application market (automobile security and the automotive electronics market) and develops automotive-grade silicon MEMS gyroscopes, as automotive product requirements a wider operating temperature range, Therefore, products will use the vehicle ceramic package. Silicon MEMS gyroscopes are mainly used in automotive chassis, it can accurately and rapidly detect the attitude under a variety of driving to help automotive active safety control systems play a role in a timely manner.
In addition, he says, we will open up Internet of things (positioning, tracking and logistics system remote control), digital cameras and the new anti-terrorism applications. For example, we can use silicon MEMS gyroscopes to achieve a simple digital camera anti-shake function.
3D-Ic Tsv Interconnects – Business Update 2010 Report
3D-IC TSV Interconnects: Business Update 2010 Report
Market Trends
The continuation of Moore’s law by conventional CMOS scaling is becoming more and more challenging, requiring huge capital investments. 3D Packaging with 3D TSV interconnects provides another path towards the “More than Moore”, with relatively smaller capital investments. Despite the impact of the economic downturn, 3D integration investments are strategic innovations and have continued. ( http://www.bharatbook.com/detail.asp?id=130243&rt=3D-IC-TSV-Interconnects-Business-Update-2010-Report.html )
We have identified as of today more than 15 different 300mm 3-D IC pilot lines running or being installed world-wide (within R&D centers, at packaging houses, CMOS foundries or within IDM fabs).
This year, several initiatives of key industry leaders happened such as STMicro for 3D integration in MEMS and CMOS image sensors, Elpida for stacked DRAM memories and Sony with the introduction of Backside illuminated (BSI) technology into its camera sensor products portfolio.
Strong dynamics in MEMS, CMOS image sensors, memory, analog and logic industries continue and will drive adoption of 3D TSVs to high volumes within the next decade. Additionally, new applications such as HB-LED silicon modules, Solar and Power components are also on the point to catch the 3D TSV trend and to benefit from this disruptive interconnect technology!
Key features of the Reports
• Updated market forecasts & technology roadmaps for 3D IC components:
– Impact of the economic downturn on the 3D TSV market
– Market forecast update for MEMS, CMOS image sensors, logic, analog and memory applications
– New application areas covered: HB-LED modules, power and solar components
– Business case for 3D interposers: applications, market and players
• 3D IC players 2008 market shares & revenues breakdown in $M (as packaging services or estimated in relative packaging value)
• Supply chain perspectives, key players and emerging infrastructure for 3D Packaging
• Strategic technology choices for 3D integration scenarios:
– Analysis of the different possibility for the implementation of TSVs and the rationale behind (via first / via middle / via last / via after bonding)
– Analysis of the cost structure for different implementation cases (vias in front-end, vias at packaging assembly house, C2W versus W2W, …)
To know more and to buy a copy of your report feel free to visit : http://www.bharatbook.com/detail.asp?id=130243&rt=3D-IC-TSV-Interconnects-Business-Update-2010-Report.html
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