3D-IC TSV Interconnects: Business Update 2010 Report
Market Trends
The continuation of Moore’s law by conventional CMOS scaling is becoming more and more challenging, requiring huge capital investments. 3D Packaging with 3D TSV interconnects provides another path towards the “More than Moore”, with relatively smaller capital investments. Despite the impact of the economic downturn, 3D integration investments are strategic innovations and have continued. ( http://www.bharatbook.com/detail.asp?id=130243&rt=3D-IC-TSV-Interconnects-Business-Update-2010-Report.html )
We have identified as of today more than 15 different 300mm 3-D IC pilot lines running or being installed world-wide (within R&D centers, at packaging houses, CMOS foundries or within IDM fabs).
This year, several initiatives of key industry leaders happened such as STMicro for 3D integration in MEMS and CMOS image sensors, Elpida for stacked DRAM memories and Sony with the introduction of Backside illuminated (BSI) technology into its camera sensor products portfolio.
Strong dynamics in MEMS, CMOS image sensors, memory, analog and logic industries continue and will drive adoption of 3D TSVs to high volumes within the next decade. Additionally, new applications such as HB-LED silicon modules, Solar and Power components are also on the point to catch the 3D TSV trend and to benefit from this disruptive interconnect technology!
Key features of the Reports
• Updated market forecasts & technology roadmaps for 3D IC components:
– Impact of the economic downturn on the 3D TSV market
– Market forecast update for MEMS, CMOS image sensors, logic, analog and memory applications
– New application areas covered: HB-LED modules, power and solar components
– Business case for 3D interposers: applications, market and players
• 3D IC players 2008 market shares & revenues breakdown in $M (as packaging services or estimated in relative packaging value)
• Supply chain perspectives, key players and emerging infrastructure for 3D Packaging
• Strategic technology choices for 3D integration scenarios:
– Analysis of the different possibility for the implementation of TSVs and the rationale behind (via first / via middle / via last / via after bonding)
– Analysis of the cost structure for different implementation cases (vias in front-end, vias at packaging assembly house, C2W versus W2W, …)
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Inertial sensors including accelerometers (or accelerometer sensor of dollars) and the angular rate sensor (gyroscope) and their single, double, three-axis combined IMU (Inertial Measurement Unit), AHRS (including magnetic sensor attitude reference system).
Is the use of MEMS accelerometer inertial sensing the quality of force measurement sensor, the general standard of quality from the block (sensor element) and the detection circuit. According to the different sensing principle, mainly piezoresistive, capacitive, piezoelectric type, the tunnel current-type, resonance type, thermal and electromagnetic coupling type and so on.
In 1998, the United States CSDL design and development of the first MEMS gyroscope. In the same year, Drapor lab developed another form of MEMS gyroscope.
MEMS gyroscope is the use of vibration-mass has been the base (shell) driven rotation of the Coriolis effect to the principle of the angular velocity sensor is made.
Mainly in the form of framework-driven (inside and outside the framework of the two kinds) comb-drive type, electromagnetic-driven and so on.
IMU because it is combination of MEMS technology, micro-inertial measurement unit, so many places called MIMU. Mainly by the three MEMS accelerometers and three gyro and the solver circuit.
AHRS consists of three magnetic sensors, compared with the IMU, and based on four elements in France to understand calculation, can output directly to a sports body pitch angle, roll angle and heading angle.
Low-precision MEMS inertial sensors, as consumer electronics products are mainly used in mobile phones, game consoles, music players, wireless mouse, digital cameras, PD, hard disk protector, smart toys, pedometer, anti-theft system, GPS navigation, portable. Because of acceleration measurement, tilt measurement, vibration measurement and even rotational measurements and other basic measurements, to be excavated consumer electronics applications will continue to emerge.
Intermediate grade MEMS inertial sensors for industrial and automotive grade products, are mainly used in automotive electronic stability systems (ESP or ESC) GPS-assisted navigation systems, automobile airbags, vehicle attitude measurement, precision agriculture, industrial automation, large-scale medical equipment, robotics , instruments | instruments and meters, construction machinery and so on.
High-precision MEMS inertial sensors as a military-grade and aerospace level products, the main demand high precision, the whole temperature range, shock and other indices. Mainly used in wireless communications satellite, missile seeker, optical targeting systems, stability of the applications; aircraft / missile flight control, attitude control, yaw damping control applications, as well as medium-range missile guidance, inertial-guided GPS navigation applications, remote aircraft ship equipment, battlefield robots.
For consumer electronics of MEMS inertial sensors, the main requirement is that the low price, small size, narrow temperature range, so accuracy is low, or even functional products. Acceleration sensors, light weight, power consumption is small, generally measuring range 1 ~ 10g ~ 50g, Resolution 2mg ~ 10mg, top general in the range ± 300 ° / s, zero-bias in the 500 ° / h ~ 1000 ° / h, so some companies products do not give a zero bias indicators or to give 0.1 ° / s ~ 0.5 ° / s.
MEMS accelerometer can be produced at present the companies are more, most of the semiconductor, such as the United States, ADI, Invensense, ST, Freescale, Sensor Dynamics, MSI (ICSensor), MEMSIC (producer in Wuxi, China) Europe, VTI, Infine, production MEMS gyroscope’s the United States, ADI, Knoix, ST, Europe, Infine, Methes, Japan, Murata, National, Oki, Fujitsu. December 3 Di Semiconductor Co., Ltd. Shenzhen, Shanghai, China issued a consumer-grade MEMS gyro, a company in Wuxi is also in development.
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